MW-300
MW-300 is a fully automatic plasma processing system for IC assembly applications. Four or eight substrates/lead-frames can be processed in parallel.
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Applications
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Reduction of copper oxide for lead-frame
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Surface cleaning and activation prior to epoxy molding
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Surface cleaning and activation prior to wire bonding
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Surface cleaning and activation prior to underfill dispensing
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Surface cleaning and activation prior to solder ball attach
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Anti-tackiness treatment
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Features
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Microwave power supply generates high density plasma species to enhance the processing speed.
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Electrode-free plasma source to eliminate the risk of electrostatic damage(ESD).
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Pulse mode operation can reduce the processing temperature.
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Adjustable track width to accommodate various substrate/lead-frame width.
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High productivity system, with magazines loading/unloading and processing in parallel.
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Automation, SECS/GEM, is available as an option.