• MW-300
  • MW-300

MW-300

E&R MW-300

MW-300 is a fully automatic plasma processing system for IC assembly applications. Four or eight substrates/lead-frames can be processed in parallel.

  • Applications

    • Reduction of copper oxide for lead-frame

    • Surface cleaning and activation prior to epoxy molding

    • Surface cleaning and activation prior to wire bonding

    • Surface cleaning and activation prior to underfill dispensing

    • Surface cleaning and activation prior to solder ball attach

    • Anti-tackiness treatment

  • Features

    • Microwave power supply generates high density plasma species to enhance the processing speed.

    • Electrode-free plasma source to eliminate the risk of electrostatic damage(ESD).

    • Pulse mode operation can reduce the processing temperature.

    • Adjustable track width to accommodate various substrate/lead-frame width.

    • High productivity system, with magazines loading/unloading and processing in parallel.

    • Automation, SECS/GEM, is available as an option.