MW-960
MW-960 is a versatile plasma processing system for IC assembly applications. Either slotted or slot-less magazines can be performed for various processes.
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Applications
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Surface cleaning and activation prior to epoxy molding
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Surface cleaning and activation prior to wire bonding
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Surface cleaning and activation prior to underfill dispensing
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Surface cleaning and activation prior to solder ball attach
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Anti-tackiness treatment
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Features
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Microwave power supply generates high density plasma species to enhance the processing speed.
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Electrode-free plasma source to eliminate the risk of electrostatic damage(ESD).
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Pulse mode operation can reduce the processing temperature.
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Rotating rack enhance the process uniformity.
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Plasma species trapped at both sides of slotted magazines enhanced the high yield of underfill dispensing.