TGV, through glass via​

Glass is an alternative to replace the silicon as the interposer material. The advantages of glass interposer include low cost, dielectric characteristics, transparent, high rigidity, CTE similar as silicon and so on.

But drilling Through Glass Via(TGV) with the high aspect ratio at the high speed is a challenge.


E&R’s Glass Technology Application patented solution to form the TGV by hybrid laser drilling and wet etching processes can reach the unparallel performance. The advantages include high throughput, high aspect-ratio, defect-free on sidewall and high density.