E&R Engineering Corporation

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      • EMC Residue Removal​
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      • Thin wafer dicing​
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      • Plasma Dicing
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  • Laser marking everywhere - E&R Technology
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  • Plasma Technology

Products

  • Laser Solution​
    • Marking
    • Micromachining
    • Analysis Tool for Advanced Process
      • Raman-WS-300A
  • Plasma Technology
    • Plasma Dicing
      • Plasma Dicing
    • Wafer Form
      • CL-1000M
      • R-300R
      • PD-200W/PD-200F
    • Panel Form​
      • MW-600
      • MW-700
    • L/F – Substrate – Others​
  • FPC Equipment​
    • RTR​
      • D/F Lamination​
      • Cover lay Pre-laminate machine​
      • Quick press(250mm)​ ​
      • RTR 200ton Quick press​
      • RTR CCD PUNCH PRESS ​
      • RTR COVER LAY PUNCH (25TON-LPF)​ ​
      • RTR COVER LAY PUNCH (35TON-LPF)​ ​ ​
      • Loading & Loading​ for AOI ​
      • Loading & Loading​ for VRS​ ​
      • Loading & Loading​ for UV Laser ​ ​
    • STS​
      • PICO laser cutting​ ​
      • Loader & Unloader​
      • Auto Adhesive-Type​
    • Lamination​
      • Pre lamination machine​
      • HH-46TON(380mm*560mm)​ Vacuum laminator​
      • HH-60TON (500mm*610mm)​ Vacuum laminator​
    • Punch​
      • Auto press machine​ ​
    • Plating​
      • ​Cu Plating Line (New)​
    • OPEN COVER MACHINE​ for Rigid-Flex ​
      • Open Cover Machine for Rigid-Flex (New)​
  • Tape and Reel
    • E&R Tape and Reel
    • Embossed Carrier Tape
    • Cover Tape
    • Reel

Plasma Technology

Plasma cleaning technology is the process of removing all organic matter from an object's surface through an ionized gas called plasma.

Plasma Dicing

Plasma Dicing (1)

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Wafer Form

Wafer Form (3)

Wafer Form Plasma Cleaning
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Panel Form​

Panel Form​ (2)

Panel Form Plasma Cleaning
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L/F – Substrate – Others​

L/F – Substrate – Others​ (6)

L/F Substrate Plasma Cleaning
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E&R Engineering Corporation
61 Heng Shan Rd, Yan-Chao District, Kaohsiung 824 Taiwan.
TEL : +886-7-6156600 #1233
FAX : +886-7-6155500 
E-mail : ercorp@enr.com.tw
enrusa@enr.com.tw
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