GC Series

Fully automatic system, employed for max. 8” wafer whose material is transparent, e.g., glass, sapphire, quartz, and so on, is integrated with functions of laser dicing, via drilling and chip separation within the same system. The workpiece is wafer-form or frame-form.

GC-200

Fully automatic system, maximum working area is 12” wafer. Fulfill chipping-free, smooth sidewall and residue-free processing.

GC-500

Fully automatic system, maximum working area is 500x500 panel.Fulfill chipping-free,smooth sidewall and residue-free processing.