WS Series

Fully automatic system, employed for max. 12” wafer grooving and via drilling,

is integrated with functions of spin-coating, laser dicing and spin- cleaning within the same system.

The workpiece is wafer-form.

WS-300

WS-300

Fully automatic system, maximum working area is 12” wafer. Linear, curve or segmented grooving and via drilling can be carried out.
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WS-200

WS-200

Fully automatic system, maximum working area is 8” wafer. Linear, curve or segmented grooving and via drilling can be carried out.
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