WS Series
Fully automatic system, employed for max. 12” wafer grooving and via drilling,
is integrated with functions of spin-coating, laser dicing and spin- cleaning within the same system.
The workpiece is wafer-form.
Fully automatic system, employed for max. 12” wafer grooving and via drilling,
is integrated with functions of spin-coating, laser dicing and spin- cleaning within the same system.
The workpiece is wafer-form.