Wafer & Frame Form

Wafer Micromaching 

E&R Wafer Micromaching provide different level and laser source for user to choose the most suitable to the application.

From Nano second to Femto second, CO laser to 355nm UV laser, User able to be more flexible on the development requirement and generate high quality, high accuracy productions to the market. E&R machine accuracy also could be control in 3nm, providing user more powerful tool and think more creative on the application 


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WD Series (2)

Fully automatic system, employed for 8”/12” wafer dicing, is integrated with functions of spin-coating, laser dicing and spin- cleaning within the same system. The workpiece is attached on the dicing frame, i.e., frame-form.

WS Series (2)

Fully automatic system, employed for 8”/12” wafer grooving and via drilling, is integrated with functions of spin-coating, laser dicing and spin- cleaning within the same system. The workpiece is wafer-form.

GC Series (2)

Fully automatic system, employed for max. 8” wafer whose material is transparent, e.g., glass, sapphire, quartz, and so on, is integrated with functions of laser dicing, via drilling and chip separation within the same system. The workpiece is wafer-form or frame-form.