E&R Engineering corp.

Inquiry

  • About E&R​
    • Introduction
      • About E&R​
      • Milestone​
      • Our Vision​
      • Core Tech​
    • Global location​
    • Organization
    • Safety Regulation​
    • Human Resource
      • Recruitment Information
      • E&R Life
    • Contact Us
  • Service
    • TGV workshop​
    • Laser process development​
    • Small scale production​
  • Technology
    • Plasma treatment
      • EMC residue removal​
      • Copper oxide removal​
      • Silicon oxide deposition​
      • Chip stress relief​
    • Laser micromachining, Silicon
      • Thin wafer dicing​
      • Wafer grooving​
    • Laser micromachining, Glass
      • TGV, through glass via​
      • Glass cavity/frame
      • Glass cutting​
    • Laser micromachining, EMC​
      • Fan-out wafer drilling/pattering​
      • Fan-in wafer dicing
    • Laser micromachining, SiC​
      • SiC wafer dicing
  • Products
    • Laser Solution​
      • Marking
        • Wafer
          • WID Series​
          • WB Series​
        • Package
          • L/F – Substrate - Boat​
            • LM Series​
            • Blazon Series​
          • Tray
            • Laser On Tray Series​
          • Others
      • Micromachining
        • Wafer & Frame Form
          • WD Series
          • WS Series
          • GC Series
        • L/F – Substrate​
        • Others
    • Plasma Technology ​
      • Wafer Form
      • Panel Form​
      • L/F – Substrate – Others​
        • Batch Type​
        • In-line Type​
    • FPC Equipment​
      • RTR​
      • STS​
      • Lamination​
      • Punch​
      • Plating​
      • OPEN COVER MACHINE​ for Rigid-Flex ​
    • Tape and Reel
      • E&R Tape and Reel
      • Embossed Carrier Tape
      • Cover Tape
      • Reel
  • Investor Relation
  • News
    • Breaking News
    • E&R Exhibition
    • Facebook Fan
繁 | En | 简
  • inside_banner
  • Inquiry ()
  • Home
  • Products
  • Tape and Reel

Products

  • Laser Solution​
    • Marking
    • Micromachining
  • Plasma Technology ​
    • Wafer Form
      • CL-1000
      • CRM-300
    • Panel Form​
      • MW-960
      • MW-600
      • MW-300
      • PECVD Series
    • L/F – Substrate – Others​
  • FPC Equipment​
    • RTR​
      • Loading & Loading​ for AOI ​
      • RTR COVER LAY PUNCH (35TON-LPF)​ ​ ​
      • RTR COVER LAY PUNCH (25TON-LPF)​ ​
      • RTR CCD PUNCH PRESS ​
      • RTR 200ton Quick press​
      • Quick press(250mm)​ ​
      • Cover lay Pre-laminate machine​
      • D/F Lamination​
      • Loading & Loading​ for VRS​ ​
      • Loading & Loading​ for UV Laser ​ ​
    • STS​
      • Loader & Unloader​
      • PICO laser cutting​ ​
      • Auto Adhesive-Type​
    • Lamination​
      • HH-60TON (500mm*610mm)​ Vacuum laminator​
      • HH-46TON(380mm*560mm)​ Vacuum laminator​
      • Pre lamination machine​
    • Punch​
      • Auto press machine​ ​
    • Plating​
      • ​Cu Plating Line (New)​
    • OPEN COVER MACHINE​ for Rigid-Flex ​
      • 開蓋機 for Rigid-Flex (New)​
  • Tape and Reel
    • E&R Tape and Reel
    • Embossed Carrier Tape
    • Cover Tape
    • Reel

Tape and Reel

E & R provide the best solutions that can meet customer’s demands for protecting the components during the storage and transportation process.

E&R Tape and Reel

E&R Tape and Reel

Advanced packaging solutions for improvement of production efficiency in the era of electronic components
More
Embossed Carrier Tape

Embossed Carrier Tape

Well made carrier tapes with accurate pocket formation
More
Cover Tape

Cover Tape

To protect both electrical and electronic components from being damaged during delivery and storage.
More
Reel

Reel

The choice of plastic reel is also a vital part of the whole procedure.
More
E&R Engineering corp.
61, Hengsang Road, Yenchaou District, Kaohsiung City 824, Taiwan
TEL : +886-7-6156600 #1233
FAX : +886-7-6155500 
E-mail : ercorp@enr.com.tw
fpcsales@enr.com.tw
  • Site Map
  • Privacy Policy
  • Human Resources
  • 利害關係人
  • Contact Us
© 2021 E&R Engineering corp. All rights reserved.