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Service
TGV workshop
Laser process development
Small scale production
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Plasma treatment
EMC residue removal
Copper oxide removal
Silicon oxide deposition
Chip stress relief
Laser micromachining, Silicon
Thin wafer dicing
Wafer grooving
Laser micromachining, Glass
TGV, through glass via
Glass cavity/frame
Glass cutting
Laser micromachining, EMC
Fan-out wafer drilling/pattering
Fan-in wafer dicing
Laser micromachining, SiC
SiC wafer dicing
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WID Series
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LM Series
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Micromachining
Wafer & Frame Form
WBS Series
WD Series
WS Series
GC Series
L/F – Substrate
Others
Plasma Technology
Wafer Form
Panel Form
L/F – Substrate – Others
Batch Type
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FPC Equipment
RTR
STS
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Punch
Plating
OPEN COVER MACHINE for Rigid-Flex
Tape and Reel
E&R Tape and Reel
Embossed Carrier Tape
Cover Tape
Reel
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E&R provides world leading laser and plasma solution
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Check out the Future Roadmap of E&R 2020
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Investor information and E&R business development
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E&R Engineering
Enlarge your dream, Success your need
放大你的夢想，成就你的想像
Laser Solution
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FPC Equipment
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