WD Series

Fully automatic system, employed for 8”/12” wafer dicing, is integrated with functions of spin-coating, laser dicing and spin- cleaning within the same system. 

The workpiece is attached on the dicing frame, i.e., frame-form.

WD-300

Fully automatic system, maximum working area is 12” wafer. Fulfill chipping-free, delamination-free, undamaged beneath layer and/or residue-free processing.

WD-200

Fully automatic system, maximum working area is 8” wafer. Fulfill chipping-free, delamination-free, undamaged beneath layer and/or residue-free processing.