E&R Engineering corp.

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  • Service
    • TGV workshop​
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  • Technology
    • Plasma treatment
      • EMC residue removal​
      • Copper oxide removal​
      • Silicon oxide deposition​
      • Chip stress relief​
    • Laser micromachining, Silicon
      • Thin wafer dicing​
      • Wafer grooving​
    • Laser micromachining, Glass
      • TGV, through glass via​
      • Glass cavity/frame
      • Glass cutting​
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      • SiC wafer dicing
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        • In-line Type​
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      • RTR​
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      • OPEN COVER MACHINE​ for Rigid-Flex ​
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Products

  • Laser Solution​
    • Marking
    • Micromachining
  • Plasma Technology ​
    • Wafer Form
      • CL-1000
      • CRM-300
    • Panel Form​
      • MW-960
      • MW-600
      • MW-300
      • PECVD Series
    • L/F – Substrate – Others​
  • FPC Equipment​
    • RTR​
      • Loading & Loading​ for AOI ​
      • RTR COVER LAY PUNCH (35TON-LPF)​ ​ ​
      • RTR COVER LAY PUNCH (25TON-LPF)​ ​
      • RTR CCD PUNCH PRESS ​
      • RTR 200ton Quick press​
      • Quick press(250mm)​ ​
      • Cover lay Pre-laminate machine​
      • D/F Lamination​
      • Loading & Loading​ for VRS​ ​
      • Loading & Loading​ for UV Laser ​ ​
    • STS​
      • Loader & Unloader​
      • PICO laser cutting​ ​
      • Auto Adhesive-Type​
    • Lamination​
      • HH-60TON (500mm*610mm)​ Vacuum laminator​
      • HH-46TON(380mm*560mm)​ Vacuum laminator​
      • Pre lamination machine​
    • Punch​
      • Auto press machine​ ​
    • Plating​
      • ​Cu Plating Line (New)​
    • OPEN COVER MACHINE​ for Rigid-Flex ​
      • 開蓋機 for Rigid-Flex (New)​
  • Tape and Reel
    • E&R Tape and Reel
    • Embossed Carrier Tape
    • Cover Tape
    • Reel

Wafer Form

CL-1000

CL-1000

E&R CL-1000
More
CRM-300

CRM-300

E&R CRM-300 Plasma Cleaning Machine
More
E&R Engineering corp.
61, Hengsang Road, Yenchaou District, Kaohsiung City 824, Taiwan
TEL : +886-7-6156600 #1233
FAX : +886-7-6155500 
E-mail : ercorp@enr.com.tw
fpcsales@enr.com.tw
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