Wafer Marking 

E&R Wafer Marking come with back-side laser solution (single, Twin), Provide user fast, high-quality marking performance. 

A specific 532nm green laser is used to perform softmark (dark mark) or hardmark (white mark) on a variety of wafer materials (Metal /Polyimide coated, bare Si grinded/non-grinded ) as well as through-tape wafer marking application


WID Series​ (2)

Design for 6, 8 & 12inch wafer to do ID (2D Code, Barcode) marking at the wafer edge within auto function

WB Series​ (1)

Designed for automatic wafer backside die marking with capability of processing6’ 8”and 12” wafer, FFC, Bare type wafer both available in 1 machine