Wafer
Wafer Marking
E&R Wafer Marking come with back-side laser solution (single, Twin), Provide user fast, high-quality marking performance.
A specific 532nm green laser is used to perform softmark (dark mark) or hardmark (white mark) on a variety of wafer materials (Metal /Polyimide coated, bare Si grinded/non-grinded ) as well as through-tape wafer marking application

WID Series (2)
Design for 6, 8 & 12inch wafer to do ID (2D Code, Barcode) marking at the wafer edge within auto function
WB Series (1)
Designed for automatic wafer backside die marking with capability of processing6’ 8”and 12” wafer, FFC, Bare type wafer both available in 1 machine