E&R Engineering Corp’s proficiency in laser development has brought femto laser to a higher level application. Thanks to its peak power characteristic, E&R now offers good control in cutting power to minimize the heat effect on a wide variety of common multi-layer materials.

Femto laser for better multi-layer material cutting solution

Femtosecond lasers are characterized by pulse duration of tens to hundreds of femtoseconds (1 fs=10~15 s), the application varies from polymer processing and medical imaging to surgical medicine. It’s one of the most advanced laser technology in the industry.

Femtosecond laser is now finding application in “cold” ablation. The high temperature of the traditional laser process can easily melt the substrate material, resulting in a by-product known as slag recast with bad performance on roughness, damaging material composition, and resulting in microchipping. However, with the arrival of the 5th generation of mobile technology, the requirement for machine accuracy will be higher, and more wafer materials will be applied. Thanks to the advances in femto lasers, E&R Engineering Corp is able to take the lead in the semiconductor industry and provide superior laser processes with self-developed optical lengths, offering customers high precision on three-dimensional cutting and laser grooving.

E&R Engineering Corp has years of experience in system integration. In the past few years, E&R has spent great R&D resources on wafer-level process equipment development and successfully launched laser process machines with +/-3 um accuracy. End users include international semiconductor companies.

Target on 5G application, Micro-Wave plasma technology provides a big panel carrier cleaning solution.

E&R Engineering Corp’s microwave plasma cleaning equipment and etching process can fulfill the user’s requirements for material uniformity and high etching rate expectations. The whole process is operated in a low-temperature environment, decreasing the risk of deformation caused by high temperatures. Besides, the free electrons property of plasma helps protect the product from electrostatic hazards and damage to the circuit.

E&R Engineering Corp offers high/low radio frequency cleaning machines and has received much positive feedback from customers. In order to fulfill the 5G market demand, E&R expanded the microwave plasma cleaning series, targeting big panel carrier applications (max: 600 mm*600 mm product). E&R also provides wafer-level plasma cleaning solutions. No matter whether it’s wafer lever or panel-level products, E&R has the ability to customize the machines following the customer’s fan-out process and satisfy the customer’s need.

Semiconductor equipment manufacturer who provides high-tech, multi-layer material integrated applications.

E&R Engineering Corp’s headquarters is located in Yenchao, Taiwan. E&R is a world-leading company that integrates both laser and plasma applications and has a great reputation in the process equipment industry worldwide. E&R works closely with every customer on process development and is capable of high-precision machining and customized equipment manufacture. Apart from the automated equipment business unit, E&R also focuses on FPC processing equipment and tape and rail package material production. E&R commits to providing superior quality machines to all customers worldwide and supports partners to reach the next generation's achievement.