With the continuous breakthroughs in semiconductor manufacturing driven by AI, high-performance computing (HPC), and 5G communications, advanced packaging has become the core battlefield of chip production. According to Yole Group, the global advanced packaging market will continue expanding at a compound annual growth rate (CAGR) of 8%–10%, with its market size expected to surpass USD 50 billion by 2025. Among them, benefiting from advantages in yield and cost, FOPLP (Fan-Out Panel Level Packaging) is forecasted to grow at an annual rate exceeding 15%.

Seizing this industry opportunity, E&R (8027) will make a grand appearance at SEMICON Taiwan 2025, presenting its latest laser and plasma solutions covering FOPLP, Silicon Via (TSV), TGV (Through Glass Via), Plasma Dicing, and more. With comprehensive process integration technologies, E&R enables customers to overcome challenges such as high I/O density, stringent warpage control, and advanced micro-fabrication, capturing growth in the rapidly expanding advanced packaging market.

FOPLP – Fan-Out Panel Level Packaging
E&R focuses on FOPLP processes, offering a complete range of equipment including laser marking, laser dicing, plasma cleaning, laser debonding, and ABF drilling. Supporting large panel sizes from 300×300mm to 700×700mm, the equipment features modular design and high-precision control. This not only significantly enhances throughput but also stably handles substrates with warpage up to 16mm, demonstrating industry-leading process capability and reliability.

Silicon Via – Advanced Applications
As demand for 3D packaging and advanced memory modules rises, TSV technology has become essential. E&R provides complete process solutions including TSV dicing, cleaning, and debonding, integrating both laser and plasma technologies. These solutions deliver precise via size control, superior edge cleanliness, low defect rates, and excellent electrical connectivity, while flexibly supporting multiple wafer sizes and materials.

Glass Substrate Solutions
In the Glass Core drilling field, E&R has developed proprietary laser modification equipment achieving via circularity >0.9, aspect ratio (AR) up to 10, and processing speed of 1500 vias per second. This solution can be widely applied in CoPoS and ABF substrates, offering high-performance and high-yield manufacturing processes for next-generation glass substrates.

OSAT-Level Precision, Globally Trusted
All E&R equipment is designed, manufactured, and tested in Taiwan, integrated with key components from leading European and U.S. brands. Widely applied in FCBGA, FCCSP, Fan-Out, and Fan-In (Wafer Level Packaging) processes, E&R has shipped more than 500 systems worldwide, serving major OSAT customers.Among them, the Flip Chip BGA solution includes Pre-Flip Chip Die Bond Plasma Cleaning, Pre-Molding/Underfill Plasma Cleaning, and On Boat/Tray Laser Marking for traceability. With complete process and equipment support, E&R helps customers ensure process quality and reliability, consistently meeting the stringent requirements of advanced packaging.

A Sincere Invitation – Co-Creating the Future of Advanced Packaging
E&R sincerely invites you to visit our booth at SEMICON Taiwan 2025. Meet our technical team face-to-face and join us in driving the future of advanced packaging and dicing technologies!

E&R Booth Information
Location: Taipei Nangang Exhibition Center Hall 1
Booth Information: 4F, #M120
Date: April 16 (Wed.) -18 (Fri.), 2025