WID-200
E&R WID Si wafer marking
E&R WID Glass wafer marking
|
Marking Performance |
|
|
Fonts |
SEMI OCR |
|
Mini. Character Height |
Bare Si 250um (Option for smaller character) |
|
Accuracy |
± 100um |
|
Repeatability |
± 25um |
|
WPH |
160 |
|
Depth of Marking |
White marking < 3 um, Dark marking < 1um |
|
Wafer Handling |
|
|
Wafer Size |
6”,8" |
|
Wafer Thickness |
≧250m |
|
Load Port |
Open cassette x 3 |
|
Alignment |
Optical alignment for both flatted and notched wafers |
|
Workstation |
|
|
Operator System |
English / Chinese |
|
Communication |
SECS II / GEM Interface optional |