E&R Engineering Corp. Unveils Cutting-Edge Solutions at Semicon SEA 2024 in Kuala Lumpur

E&R Engineering Corp., is confirmed to attend the feast in Semiconductor industry, Semicon SEA 2024, held in Kuala Lumpur, Malaysia. With the 30-year dedication in the semiconductor industry, E&R had developed a wide range of plasma and laser technology. At Semicon SEA 2024, we will showcase their latest solutions, including:

Plasma Dicing – Small Die Dicing Solution

E&R offers a hybrid solution combining laser grooving and plasma dicing, allowing for dice lanes controlled between 10um ~ 30um. In addition to equipment manufacturing, E&R also provides the one-stop-shop dicing service (outsourcing service) to process wafers into small dies for various shapes, hexagonal, circular or MPR pattern.

Advanced Packaging

With extensive expertise in the integration of self-developed optics module and advanced laser system, E&R provides a laser drilling solution for 2.5D/3D packaging, featuring high accuracy up to +/- 5um, of which the B/T ratio achieves 85~90%. Besides, E&R is also renowned for our precision laser marking integrated with 4 beam marking solution for high throughput while remaining +/- 25um accuracy, excellence in heat affect control for laser cutting, and high uniformity (CPK >1.33) plasma solutions.

Glass Substrate Solutions

E&R is one of the leading equipment manufacturers supporting glass substrate process. Besides high productivity TGV solutions reaching 600~1,000 VPS while maintaining an accuracy of 5 um-3 sigma, we also provide advanced solutions for Glass Laser Polishing to improve the roughness of glass sidewall, laser beveling, and AOI techniques.

Silicon Carbide Solutions

E&R provide a series of solutions including shallow layer laser annealing after ion implantation, to activate ions and restore the crystal lattice, SiC wafer ID marking and plasma cleaning. Additionally, we also launch the Raman Inspection Machine to detect crack, defect and internal stress, to efficiently enhance the process yield.  

FOPLP – Fan-Out Panel Level Package for 700*700mm

E&R develops a full range of machines supporting large panel process up to 700*700mm panel size, containing laser marking, cutting and plasma cleaning and de-smear after drilling. The competence on warpage handling excellently reaches 16mm while remaining the high throughput competence.

This year, E&R will join a co-exhibition with our strategic partner, Zen Voce, at Semicon SEA 2024. Beside all the mentioned technology, E&R is also capable of dealing with high customized requirement and the joint development with our customers. Together with E&R, we can be your most excellent and reliable partners, and expect to have your visit and engagement at our booth to explore all the innovation from E&R.

Booth Information of E&R at Semicon SEA 2024

• Booth Number: #714
• Hall: 2-4
• Location: Malaysia International Trade and Exhibition Center
• Time: May.28th to 30th, 2024
• E&R : en.enr.com.tw