E&R (8027.TWO) — Advanced Laser & Plasma Innovation Provider
We sincerely invite you to the 2025 Electronics Equipment Exhibition, where we will showcase our FOPLP solutions and the key material for future advanced packaging—glass substrates. Visit us at Booth M120 to explore the latest trends in advanced packaging technologies together.

FOPLP (Fan-Out Panel Level Packaging)
E&R provides reliable mass-production equipment for FOPLP, supporting panel sizes from 300*300 mm to 700*700 mm. Our solutions include laser marking, laser cutting, plasma cleaning, de-smear, laser debonding, post-debond plasma descum, and ABF drilling, all with excellent warpage handling capabilities of up to 16 mm, ensuring high-efficiency output.

Glass Substrate Solutions
E&R pioneers TGV technology and leads the E-Core Glass Substrate Alliance to advance Glass Core processes. At this exhibition, we will showcase a 515*510mm Glass Core sample featuring laser modification (TGV), wet etching, and more.

E&R Booth Information

• Location: Taipei Nangang Exhibition Center Hall 1
• Booth Information: 4F, #M120
• Date: April 16 (Wed.) -18 (Fri.), 2025