E&R (8027.TWO) —  Advanced Laser & Plasma Innovation Provider, cordially invites you to visit us at Touch Taiwan 2026.
At this exhibition, we will showcase:

• FOPLP (Fan-Out Panel Level Packaging) solutions
• High-precision glass cutting with ABF grooving for lane-defined applications
• Glass substrate solutions for advanced packaging

We look forward to engaging with you in person and sharing the latest trends and technological advancements in advanced packaging.
We sincerely invite you to visit us at booth M212 and explore the future of semiconductor manufacturing together.

• E&R Booth Information
• Location: Taipei Nangang Exhibition Center Hall 1
• Booth Information: 4F, #M212
• Date: April 8 (Wed.) -10 (Fri.), 2026