E&R Engineering to Feature Advanced Packaging and CPO Innovations at ISIG 2026 Symposium

KAOHSIUNG, Taiwan – April 15, 2026 – E&R Engineering Corp. (8027.TW), an innovation provider of semiconductor process equipment, is pleased to announce its participation in the International Semiconductor Industry Group (ISIG) Symposium, held April 20–21, 2026, at the Plug and Play Tech Center in Sunnyvale, California.
Following the recent opening of its second North American operational site in Hillsboro, Oregon, E&R Engineering is intensifying its focus on the "Silicon Valley" ecosystem. The company’s participation at ISIG underscores its commitment to supporting the rapid industry shift toward Advanced Packaging, Co-Packaged Optics (CPO), FOPLO and Through-Glass Via (TGV) technologies.

Technical Highlights: Advanced Packaging & CPO 

At ISIG 2026, E&R will highlight several core technologies aimed at supporting high-performance computing (HPC) and AI-driven applications: 

• Advanced Packaging & CPO: Specialized plasma cleaning and laser applications that optimize high-bandwidth optical interconnects and heterogeneous integration.
• FOPLP – Fan-Out Panel Level Packaging (700 × 700 mm): E&R’s total solution supports large panel processes including laser marking, cutting, descum, plasma cleaning, and post-drill de-smear, with warpage control up to 16 mm. The process is further enhanced with laser debonding and plasma dry etching for glass carrier separation.
• TGV (Through-Glass Via) Innovations: High-accuracy laser and process capabilities tailored for glass substrates, enabling the next generation of high-density interconnects.
• AIS (Automation Integration Service): A "design-to-implementation" model that integrates multiple process modules into unified, custom systems. AIS has already secured significant North American orders and is expected to be a major revenue driver through 2027.

Advancing U.S. Expansion to Drive Local Support and Global Integration

With established service hubs in Phoenix, Arizona and the Portland, Oregon area, E&R is strengthening its North American presence by delivering faster, localized technical support to key customers. This regional expansion not only improves service efficiency and capacity—extending order visibility into 2027—but also serves as a bridge between Taiwanese engineering expertise and the U.S. semiconductor supply chain, enabling smoother transitions from equipment installation to high-volume production.

Event Information:

• Dates: April 20–21, 2026 (Monday–Tuesday)
• Venue: Plug and Play Tech Center
• Address: 440 N Wolfe Rd, Sunnyvale, CA 94085

For more information, please visit https://en.enr.com.tw/

About E&R Engineering Corp. Founded in 1988, E&R Engineering Corp. (8027.TW) specializes in the R&D and manufacturing of process equipment for the semiconductor, FPC, and LED industries. With core strengths in laser applications, plasma cleaning, and precision automation, E&R is a strategic partner to global industry leaders.