E&R Engineering (8027) — Advanced Laser & Plasma Innovation Provider — is pleased to participate once again in SEMICON SEA 2026. With years of experience in the semiconductor industry, E&R continues to deliver high-precision laser and plasma process technologies to help customers improve yield, optimize processes, and accelerate mass production.

This year, we will showcase solutions focused on advanced packaging and new material applications, addressing the growing demands of HPC, AI, and next-generation electronics, while demonstrating our integrated laser and plasma capabilities.

Featured technologies include:

• CPO (Co-Packaged Optics) key process applications
• High-precision glass cutting
• FOPLP advanced packaging solutions
• Glass substrate and SiC process solutions
• AIS automation integration solutions

In addition, E&R will co-exhibit with our strategic partners, Group Up and HTA, to provide a more comprehensive one-stop solution.

We sincerely invite you to visit us and explore future innovations together.

Booth Information:

• Venue: MITEC (Malaysia International Trade & Exhibition Centre)
• Booth: Level 1, #1452
• Date: May 5 – 7, 2026