※〔EXHIBITION NEWS〕E&R Driving Next-Generation Semiconductor Process Solutions at SEMICON Taiwan 2026
E&R Engineering Corp. (TPEX: 8027), an innovation provider in semiconductor laser and plasma process equipment, is highlighting game-changing applications in:
- Glass Core, Glass Carrier Processing
- High-Precision FAU Micro-Machining
- Latest Cutting-edge Laser and Plasma Equipment
✦ Exhibition Highlights
- High-Precision FAU Drilling Solution — ±0.5 μm
- Designed to meet the processing requirements of 2D FAU 3.2T, 6.4T, and 12.8T, featuring advanced 5-axis ultrafast laser drilling technology for high-precision micro-hole processing.
- Next-Generation TGV Glass Core / Glass Carrier / ABF Grooving / Glass Cutting Solutions
- Glass Core TGV Process
- Glass Carrier Debonding & Descum Solution
- High-Precision Glass Cutting with ABF Grooving for Lane Defined
- Featured Equipment
- PHB-600A
Designed for large-size glass substrates and high-precision laser applications.
- R-300R
Featuring a Hybrid MW–RF Plasma System with independent control capabilities, the R-300R supports a wide range of processes, from low-damage surface activation and cleaning to Descum, De-smear, and Deep Silicon Etching.
From Glass Core and Glass Carrier to high-precision FAU micro-hole processing, E&R Engineering Corp. continues to leverage high precision laser × plasma technologies to develop next-generation semiconductor process solutions.
We sincerely invite you to visit E&R Engineering Corp. at Booth M1048 to explore our latest technologies and applications, and discover new possibilities in next-generation semiconductor and advanced packaging processes.
We look forward to meeting you at SEMICON Taiwan 2026!
- Exhibition Information
- Venue: Taipei Nangang Exhibition Center, Hall 1, 4F
- Booth: M1048
- Date: September 2–4, 2026
2026-08-17