• GC-200

GC-200

Fully automatic system, maximum working area is 12” wafer. Fulfill chipping-free, smooth sidewall and residue-free processing.

Fully automatic system, maximum working area is 12” wafer :

•Cold ablation, fulfill chipping-free,smooth sidewall(Ra<1um) and  residue-free processing.
•Powerful capability, chips with regular or irregular dimensions can be cut as usual.
•Applicable for varieties of materials, e.g., Glass, Quartz, Sapphire, SiC…and so on.
•Versatile operational modes, machining route can be set by recipe or imported by DXF file.
•Options :
•Mechanical breaking  & Tape expansion module
•V-cut optics
•Via drilling function
•Semi-S2 certified.

Meet current and future requirements.

Workpiece

Diameter

8” wafer

Thickness

<2.5mm

Carrier

Wafer mounted on the dicing frame

Laser & Optics

Type

Pico-econd laser

Power

<50W or <150W

Repetition rate

<600kHz

In-situ power monitor

Moving stage

Working area

210x210mm max.

Speed

1000mm/sec, max.

Resolution

0.1um

Position accuracy

<3um for cutting

<5um for drilling

Z-axis

Stroke

+/- 3 mm

Repeatability

1um, single direction

θ-axis

Stroke

<190°

Repeatability

<2 arc-sec

Vision

Quantity

High & low magnification

Resolution

0.56um for high magnification

Mechanical breaking

(Optional)

Air blow

2~4kg/cm2

Roller ejection amount

0~10mm

Upthrust amount

0~20mm

Via drilling

(Optional software)

Data input

DXF

Raster mode available

V-cut optics

(Optional)

Single or multi foci switchable

Working distance

1mm