• GC-500

GC-500

Fully automatic system, maximum working area is 500x500 panel.Fulfill chipping-free,smooth sidewall and residue-free processing.

Fully automatic system, maximum working area is 500x500 panel :

-Cold ablation, fulfill chipping-free,、smooth sidewall(Ra<1um) and  residue-free processing.
-Powerful capability, chips with regular or irregular dimensions can be cut as usual.
-Applicable for varieties of materials, e.g., Glass, Quartz, Sapphire, SiC…and so on.
-Versatile operational modes, machining route can be set by recipe or imported by DXF file.
-Options :
•Thermal separation module
•V-cut optics
•Via drilling function
-Semi-S2 certified.

Meet current and future requirements.

Workpiece

Dimension

500x500 panel

Thickness

<2.5mm

Laser & Optics

Type

Pico-econd laser

Power

<50W or <150W

Repetition rate

<600kHz

In-situ power monitor

Moving stage

Working area

510x510mm max.

Speed

1000mm/sec, max.

Resolution

0.1um

Position accuracy

<5um

Z-axis

Stroke

+/- mm

Repeatability

1um, single direction

Vision

Quantity

High & low magnification

Thermal separation

(Optional)

CO2 laser

200W/500W

Via drilling

(Optional software)

Data input

DXF

Raster mode available

V-cut optics

(Optional)

Single or multi foci switchable

Working distance

1mm