Inquiry
About E&R
Introduction
About E&R
Milestone
Our Vision
Core Tech
Global location
Organization
Safety Regulation
Human Resource
Recruitment Information
E&R Life
Contact Us
Service
TGV workshop
Laser process development
Small scale production
Technology
Advanced Packaging (AP)
Fan Out PLP
Plasma treatment
EMC Residue Removal
Copper oxide removal
PECVD
Chip stress relief
Laser micromachining, Silicon
Thin wafer dicing
Wafer grooving
Laser micromachining, Glass
TGV, through glass via
Glass cavity/frame
Glass cutting
Laser micromachining, EMC
Fan-out wafer drilling/pattering
Fan-in wafer dicing
SiC Solution
Wafer dicing
Laser ID Marking
Plasma cleaning
Backend Process Solution
Products
Laser Solution
Marking
Wafer
WID Series
WB Series
Package
L/F – Substrate - Boat
LM Series
Blazon Series
Tray
Laser On Tray Series
Others
Micromachining
Wafer & Frame Form
WBS Series
WD Series
WS Series
GC Series
L/F – Substrate
Others
Analysis Tool for Advanced Process
Plasma Technology
Plasma Dicing
Wafer Form
Panel Form
L/F – Substrate – Others
Batch Type
In-line Type
FPC Equipment
RTR
STS
Lamination
Punch
Plating
OPEN COVER MACHINE for Rigid-Flex
Tape and Reel
E&R Tape and Reel
Embossed Carrier Tape
Cover Tape
Reel
Investor Relation
Corporate ESG Section
ESG Report
Shareholders Section
Shareholders' Meeting Information
Finance Section
Financial Report
Corporate Governance
Organizational Operating Regulations
Board information
News
Breaking News
E&R Exhibition
Facebook Fan
繁
En
简
繁
|
En
|
简
Inquiry
(
)
Contact Us
Home
Products
FPC Equipment
Plating
Cu Plating Line (New)
Cu Plating Line (New)
Cu Plating Line for Flip Chip Substrate
Q'ty :
Add To Inquiry
Description
Length : 20 M
Width : 3.5 M
Height : 2 M
Rinsing ➝ micro-etching ➝ Rinsing ➝ pre-dipping ➝ rack plating(Copper) ➝ Rinsing
