CL-1000M is a fully automatic plasma processing system for frame-form applications. Workpiece, e.g. diced wafer, BGA/CSP substrate, QFN lead-frame, mounted on the dicing fame can be processed by this system.

• Application

• Surface cleaning and activation prior to epoxy molding
• Anti-tackiness treatment
• Epoxy Molding Compound (EMC) thinning
• Plasma De-Flash: Residue removal of Epoxy Molding Compound(EMC) after molding
• Plasma De-Smear: Residue removal of Epoxy Molding Compound(EMC) after laser drilling
• Chip sidewall etching to enhance the die strength
• Surface cleaning and activation prior to epoxy molding

• Feature

• Microwave plasma source provides no ESD solution and isotropic etching process.
• Cooling chuck is optional available to prevent the dicing tape from damage.
• Rotating chuck enhances the process uniformity.
• System can be configured for 6”, 8” or 12” dicing frame.
• Automation, SECS/GEM, is available as an option.