R-300R is a fully automatic, two-chamber, plasma processing system for the bare wafer applications.

• Application

• Epoxy Molding Compound(EMC) thinning
• Residue removal of Epoxy Molding Compound(EMC) after molding, plasma de-flash
• Residue removal of Epoxy Molding Compound(EMC) after laser drilling, plasma de-smear
• Photoresist removal and descum in bumping process
• Sacrificial layer removal , i.e. Photoresist, polyimide, Silicon oxide, PMMA and so on
• Wafer backside stress relief
• Through Silicon Via(TSV) exposing(active side attached on back-grinding tape)

• Feature
• Microwave plasma source, providing isotropic etching
• Temperature controllable chuck is optional available, ranging from RT to 250 °C
• Cooling chuck is optional available to prevent the back-grinding tape from damage
• Spin processor is optional available for post-cleaning
• System can be configured for 8” or 12” wafers using open cassette as well as FOUP or SMIF load-ports
• Hydrogen generator is optionally available as a point-of-use gas supply.
• Automation, SECS/GEM, is available as an option