Plasma cutting equipment: PD-200WA/PD-200F are fully automatic and suitable for wafer form up to 8" and iron frame types plasma cutting operations. It has the following features:

• Features
• Non-Scallop process: improve grain strength
• Low temperature process: no risk of tape damage
• Using Microwave: No ESD damage
• Low temperature process: no risk of tape damage
• Suitable for non-rectangular cutting
• Can work on multiple small-sized wafers at the same time
• Cost-effective equipment
• Software support:
• Data log, Error/Error recovery
• Periodic maintenance records
• SECS/GEM