Introduction 

• Microwave

• High density of neutral atomic oxygen relative to ions.
• Rack for magnetic field designed.
  High efficiency, uniformity microwave power delivery.
  High ash rate (4~7 um/min).

• Microwave Plasma

• No UV exposure

• ECR Plasma produce around magazines to increase clean ability
• Cool plasma before reaching the product

• Application

• Wire bond
• Mold
• Flip Chip Underfill

MW-960 Microwave Plasma Clean (Batch)

MW-960 is a versatile plasma processing system for IC assembly applications. Either slotted or slot-less magazines can be performed for various processes

• Applications

• Surface cleaning and activation prior to epoxy molding
• Surface cleaning and activation prior to wire bonding
• Surface cleaning and activation prior to underfill dispensing
• Surface cleaning and activation prior to solder ball attach
• Anti-tackiness treatment

• Features

• Microwave power supply generates high density plasma species to enhance the processing speed
• Electrode-free plasma source to eliminate the risk of electrostatic damage(ESD)
• Pulse mode operation can reduce the processing temperature
• Rotating rack enhance the process uniformity
• Plasma species trapped at both sides of slotted magazines enhanced the high yield of underfill dispensing

Chamber Mechanism

Lead Frame 水滴角均勻性測試

• Experimental lead frame 144 mm(L) by 60 mm(W)
• Water drop angle values are less than 40 degree with magazine type.