DB-200
Design for Advanced Thinning Substrate Solution
“Dual Stage/Carrier transfer, Bottom CCD position, flexible load-unload design as BEST system combination solution”
Warpage ≦10 mm
Advanced thinning substrate might cause higher warpage
Carrie-car design transferring easy to get over high warpage substrate
Enhance accuracy design with outstanding throughput performance
Bottom V.P.S(Vision Position System) enhance marking accuracy within ± 0.05mm
Dual Stage/Carrier design performance outstanding throughput
Change over time < 10min
High Flexibility load-unload design
Design for both Stack, Slot magazine loader, available for OSATs current product line
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*Panel – 300mm*300mm
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DB-200 Process Flow
| Laser Marking_BlazonSeries_DB Series DM |
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