• DB-200

DB-200

E&R DB-200 Laser Marking Machine​

Design for Advanced Thinning Substrate Solution 

“Dual Stage/Carrier transfer, Bottom CCD position, flexible load-unload design as BEST system combination solution”


Warpage ≦10 mm

Advanced thinning substrate might cause higher warpage

Carrie-car design transferring easy to get over high warpage substrate 


Enhance accuracy design with outstanding throughput performance

Bottom V.P.S(Vision Position System) enhance marking accuracy within ± 0.05mm

Dual Stage/Carrier design performance outstanding throughput 


Change over time < 10min




High Flexibility load-unload design


Design for both Stack, Slot magazine loader, available for OSATs current product line 



Type

Available

L/F

O

Substrate

O

Panel 

X

Boat

X

Tray

X


*Panel – 300mm*300mm



Item

DB-200

Machine size

3200x1900x2000

Load-unload System

Strip type

L/F type

Runner size

W:   60-100mm

L:   180-300mm

Load-unload Q’ty

5

Warpage available

±10 mm

Position

Bottom

Position Accuracy and Repeatability

±50um

Carrier type

Dual Stage


DB-200 Process Flow

db200-2.jpg