DB-200
Design for Advanced Thinning Substrate Solution
“Dual Stage/Carrier transfer, Bottom CCD position, flexible load-unload design as BEST system combination solution”
Warpage ≦10 mm
Advanced thinning substrate might cause higher warpage
Carrie-car design transferring easy to get over high warpage substrate
Enhance accuracy design with outstanding throughput performance
Bottom V.P.S(Vision Position System) enhance marking accuracy within ± 0.05mm
Dual Stage/Carrier design performance outstanding throughput
Change over time < 10min
High Flexibility load-unload design
Design for both Stack, Slot magazine loader, available for OSATs current product line
|
Type |
Available |
|
L/F |
O |
|
Substrate |
O |
|
Panel |
X |
|
Boat |
X |
|
Tray |
X |
*Panel – 300mm*300mm
|
Item |
DB-200 |
|
Machine size |
3200x1900x2000 |
|
Load-unload System |
Strip type L/F type |
|
Runner size |
W: 60-100mm L: 180-300mm |
|
Load-unload Q’ty |
5 |
|
Warpage available |
≦±10 mm |
|
Position |
Bottom |
|
Position Accuracy and Repeatability |
±50um |
|
Carrier type |
Dual Stage |
DB-200 Process Flow
